B&R Industrial Automation will exhibit its latest packaging solutions at booth S-3179 at PACK EXPO International, November 2-5, 2014 in Chicago’s McCormick Place, where, along with the new co-located Pharma EXPO, over 50,000 packaging professionals will come together. With flexible I/O solutions, modern industrial multi-touch HMIs, modular drive systems and Panel PCs that implement the latest Intel® Atom technology, B&R solutions provide the performance, flexibility and interoperability necessary for advanced packaging machinery automation. B&R utilizes open communication protocols, and modular, standards-based software programming and data handling for control systems that simplify integration and operation.

Free automation company can supply B&R automation I/O module to help user solve their problem.